Description

8″ – 3M™ 3762LMQ Low-Melt Glue Sticks

Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.

Excellent “hot-tack” when dispensed at low-melt temperatures.
Can bond expanded polystyrene, corrugated packaging and displays.
25 second bonding range.
FDA listed.